Scientists from Nagoya University in Japan have developed an innovative cooling device—an ultra-thin loop heat pipe—that significantly improves heat control for electronic components in smartphones ...

Smartphones and tablets are no strangers to the limits imposed by heat-constraints. Without proper airflow and limited space for cooling components, mobile devices are stuck balancing CPU clock speeds ...

Fujitsu has developed a new cooling solution aimed at compact electronic devices. The new heatpipe cooler design, measuring just 1mm at its thickest is said to be "capable of transferring ...