Recently, a research team led by Prof. NI Yong and Prof. HE Linghui from the University of Science and Technology of China (USTC) uncovered the propagation and toughening mechanism of tortuous crack ...
The application of electromagnetic technology is becoming increasingly widespread, constantly expanding the scope of people's ...
The Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) is requesting information to guide the establishment of a domestic research and development (R&D) center for ...
Microtransfer printing (µTP) is an advanced manufacturing technique that enables the precise transfer of micro and nanoscale materials from a donor substrate to a receiving substrate. This process ...
As chips evolve toward stacked, heterogeneous assemblies and adopt more complex materials, engineers are grappling with new and often less predictable sources of variation. This is redefining what it ...
Newer technologies such as 3D chips and heterogeneous packaging is pushing the focus towards materials engineering, Prabu Raja, president, of the Semiconductor Products Group at Applied Materials told ...
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