Playing a crucial interconnect role in integrated circuits and semiconductor testing, test sockets, aka package probes, serve the role of connecting a device and its tester. IC sockets are categorized ...

Offering improved bandwidth over previous versions, the Center Probe test sockets feature an insertion loss of less than 1 dB in frequencies to 18.5 GHz (less than 3 dB to 39.7 GHz) and a VSWR of less ...

High-frequency center-probe and CSP/MicroBGA test and burn-in sockets are offered in sizes to 6.5-mm2 with pitches down to 0.3 mm to meet the growing need for testing smaller components. The sockets ...

The new Springtac flat sockets are said to give reliable contact for the most demanding test applications. Designed to fit into small test connectors, the flat Springtac sockets can mate with 2.8 mm ...

A technical paper titled “Fabrication and Characterization of Three-Dimensional Microelectromechanical System Coaxial Socket Device for Semiconductor Package Testing” was published by researchers at ...