With all the electronic subsystems packed into today’s vehicles, testing can be tricky. Here are some switch-system design techniques to help avoid testing pitfalls. The sophistication of today’s ...

Traditionally, the packaged integrated circuit (IC) has been much larger than the IC itself because standard packages must also contain the lead-frame and bond wires. That wasn’t an issue for decades ...

Schaumburg, Ill. — Omron Electronic Components LLC has introduced the G5T series of slim power PCB relays in a 7.0 x 20.4 x 15.0-mm (WxLxH) footprint, making them suitable for high-density ...

Efficient Power Conversion (EPC) introduces the 150 V, 6 mΩ EPC2308 GaN FET, offering higher performance and smaller solution size for high power density applications including DC-DC conversion, AC/DC ...

Application density for aerosol sunscreen is higher than that of lotion in practical use, according to a cross-sectional study. “Based on our results, spray sunscreen may provide higher but still ...

Several packaging houses are developing the next wave of high-density fan-out packages for premium smartphones, but perhaps a bigger battle is brewing in the lower density fan-out arena. Amkor, ASE, ...

Density functional theory (DFT) has emerged as a robust computational framework for analysing fluid systems at the molecular level, offering detailed insights into phase behaviour, interfacial ...

Operating up to 3 GHz, the MM1205 six-channel SPST relay from Menlo Micro is useful for signal switching applications in DC, analog, and RF circuits. The device, which integrates a relay driver and ...