The semiconductor industry is undergoing a profound shift in packaging technologies to ones that rely on close collaboration among multiple stakeholders to solve intricate, multi-faceted, and ...

PTAG to acquire Construct-X, uniting leaders in AWP and digital project delivery to transform industrial capital projects through innovation and collaboration. PTAG and Construct-X, bringing together ...

Expands Advanced Packaging Platform Across Wafer-Level and Panel-Level Applications in Key Global Markets-FREMONT, Calif., Feb. 26, 2026 ...

Nvidia’s CEO Jensen Huang has made waves by saying that his company’s most advanced artificial intelligence (AI) chip, Blackwell, will transition from CowoS-S to CoWoS-L advanced packaging technology.

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...

Advanced packaging is no longer operating behind the scenes. The technology of advanced packaging is helping to sustain the speed of the semiconductor industry’s improvement in power and performance, ...

GlobalFoundries has signed a Memorandum of Understanding with Singapore's Agency for Science, Technology and Research (A*STAR) to enhance its advanced packaging capabilities in response to the growing ...

TORONTO, April 15, 2025 /PRNewswire/ - PTAG Inc. ("PTAG") and Intelligent Construction Experts, LLC, doing business as Construct-X ("Construct-X"), are pleased to announce that they have entered into ...